Display device and electronic apparatus

ABSTRACT

According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2010-109525, filed May 11, 2010, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a display device and anelectronic apparatus including a cooling fan.

BACKGROUND

Some display devices and electronic apparatuses include cooling fans.

BRIEF DESCRIPTION OF THE DRAWINGS

A general architecture that implements the various features of theembodiments will now be described with reference to the drawings. Thedrawings and the associated descriptions are provided to illustrate theembodiments and not to limit the scope of the invention.

FIG. 1 is an exemplary perspective view illustrating an electronicapparatus according to a first embodiment;

FIG. 2 is an exemplary plan view illustrating a lower wall of theelectronic apparatus shown in FIG. 1;

FIG. 3 is an exemplary perspective view illustrating the lower wall anda circumferential wall of the electronic apparatus shown in FIG. 1;

FIG. 4 is an exemplary plan view illustrating the inside of theelectronic apparatus shown in FIG. 1;

FIG. 5 is an exemplary perspective view illustrating the inside of theelectronic apparatus shown in FIG. 1;

FIG. 6 is an exemplary plan view illustrating the inside of theelectronic apparatus shown in FIG. 1 with some sealing members removed;

FIG. 7 is an exemplary plan view illustrating a wiring pattern of acircuit board shown in FIG. 6;

FIG. 8 is an exemplary plan view illustrating the inside of theelectronic apparatus shown in FIG. 1;

FIG. 9 is an exemplary cross-sectional view illustrating the electronicapparatus taken along the line F9-F9 of FIG. 8;

FIG. 10 is an exemplary cross-sectional view illustrating the electronicapparatus taken along the line F10-F10 of FIG. 8;

FIG. 11 is an exemplary cross-sectional view illustrating the electronicapparatus taken along the line F11-F11 of FIG. 8;

FIG. 12 is an exemplary cross-sectional view schematically illustratingthe inside of the electronic apparatus shown in FIG. 8;

FIG. 13 is an exemplary cross-sectional view schematically illustratingthe inside of the electronic apparatus taken along the line F13-F13 ofFIG. 12;

FIG. 14 is an exemplary cross-sectional view schematically illustratinga duct structure of the electronic apparatus shown in FIG. 8;

FIG. 15 is an exemplary cross-sectional view illustrating an electronicapparatus according to a second embodiment; and

FIG. 16 is an exemplary perspective view illustrating a display deviceaccording to a third embodiment.

DETAILED DESCRIPTION

Various embodiments will be described hereinafter with reference to theaccompanying drawings.

In general, according to one embodiment, an electronic apparatuscomprises a housing comprising an outlet, a cooling fan in the housing,a component in the housing configured to serve as a wall guiding airfrom the cooling fan to the outlet, and a wind shielding portion betweenthe component and an inner surface of the housing.

Hereinafter, exemplary embodiments applied to a notebook personalcomputer (hereinafter, referred to as a notebook PC) and a televisionwill be described with reference to the accompanying drawings.

First Embodiment

FIGS. 1 to 14 show an electronic apparatus 1 according to a firstembodiment. The electronic apparatus 1 is, for example, a notebook PC.However, electronic apparatuses to which the embodiment can be appliedare not limited thereto. The embodiment can be widely applied to variouskinds of electronic apparatuses including a display device, such as atelevision, a recording/reproducing apparatus, a PDA (Personal DigitalAssistant), and a game machine.

As shown in FIG. 1, the electronic apparatus 1 includes a main unit 2, adisplay unit 3, and a hinge 4. The main unit 2 is an electronicapparatus main body provided with a main board. The main unit 2 includesa housing 5. The housing 5 has a flat box shape including an upper wall6, a lower wall 7, and a circumferential wall 8.

The lower wall 7 faces a desk surface when the electronic apparatus 1 isplaced on a desk. The lower wall 7 is substantially parallel to the desksurface. The upper wall 6 is opposite to the lower wall 7 with a spacetherebetween and extends substantially in parallel (that is,substantially in a horizontal direction) to the lower wall 7. A keyboard9 is attached to the upper wall 6. The circumferential wall 8 rises withrespect to the lower wall 7, and connects the edge portion of the lowerwall 7 and the edge portion of the upper wall 6.

The housing 5 includes a base 11 and a cover 12. The base 11 includesthe lower wall 7 and a part of the circumferential wall 8. The cover 12includes the upper wall 6 and a part of the circumferential wall 8. Thecover 12 is combined with the base 11 to form the housing 5.

The housing 5 includes a rear end portion 13 (first end portion) towhich the display unit 3 is rotatably connected and a front end portion14 (second end portion) disposed opposite to the rear end portion 13.The circumferential wall 8 includes a front wall 8 a, a rear wall 8 b, aleft wall 8 c, and a right wall 8 d. The front wall 8 a extends in thewidth direction (left-right direction) of the housing 5 at the front endportion 14. The rear wall 8 b extends in the width direction of thehousing 5 at the rear end portion 13. The left wall 8 c and the rightwall 8 d extend in the depth direction (front-rear direction) of thehousing 5 and connect the end portions of the front wall 8 a and the endportions of the rear wall 8 b.

The display unit 3 is rotatably (openably) connected to the rear endportion 13 of the main unit 2 by the hinge 4. The display unit 3 can bepivoted between a closed position where the display unit 3 falls andcovers the main unit 2 from the upper side and an opened position wherethe display unit 3 rises with respect to the main unit 2.

As shown in FIG. 1, the display unit 3 includes a display housing 15 anda display panel 16 in the display housing 15. A display screen 16 a ofthe display panel 16 can be exposed to the outside through an openingportion 15 a in the front wall of the display housing 15.

As shown in FIG. 1, the upper wall 6 includes a keyboard mountingportion 17 to which the keyboard 9 is attached and a palm rest 18. Thepalm rest 18 is in front of the keyboard mounting portion 17 in thedepth direction, that is, between the keyboard mounting portion 17 andthe front wall 8 a. As shown in FIG. 9, the keyboard mounting portion 17is recessed from the palm rest 18 to the inside of the housing 5. Inthis way, the height of the upper surface of the keyboard 9 attached tothe keyboard mounting portion 17 is substantially equal to or slightlyhigher than that of the upper surface of the palm rest 18.

As shown in FIG. 2, a plurality of leg portions 19 is provided on thelower wall 7 of the housing 5. The leg portions 19 come into contactwith the desk surface and the lower wall 7 of the housing 5 is supportedat a position separated from the desk surface. As shown in FIGS. 2 and3, the housing 5 includes first inlets 21, second inlets 22, and thirdinlets 23. The first inlets 21, the second inlets 22, and the thirdinlets 23 are separated from one another and are provided so as to beconcentrated in, for example, the front left portion of the housing 5.

As shown in FIG. 2, the first inlets 21 and the third inlets 23 areprovided in the lower wall 7. The first inlets 21 are below a coolingfan 24, which will be described below, so as to face the cooling fan 24.The third inlets 23 are not below the cooling fan 24. The third inlets23 are located between the first inlets 21 and the front wall 8 a.

As shown in FIG. 3, the second inlets 22 are provided in the left wall 8c. The second inlets 22 are, for example, opening portions for exposingvarious kinds of connectors 25. The second inlets 22 enable fresh air toflow into the housing 5 through the gap between the connector 25 and thehousing 5.

As shown in FIG. 3, the housing 5 includes first outlets 26 and secondoutlets 27. The first outlets 26 are provided in the left wall 8 c atthe rear end portion 13 of the housing 5, and located, for example, inthe side of the keyboard 9 and in the rear end portion 13. The firstoutlets 26 face a heat sink 28, which will be described below, from theside thereof. The second outlets 27 are provided in the lower wall 7 atthe rear end portion 13 of the housing 5 and face the heat sink 28 fromthe lower side thereof. As shown in FIG. 2, an opening portion 30,through which a docking connector 29 is exposed to the outside, isprovided in the lower wall 7.

As show in FIG. 4, the housing 5 accommodates a circuit board 31, an ODD32 (Optical Disk Drive), a storage device 33, the heat sink 28, a heatpipe 34, a heat radiating plate 35, and the cooling fan 24. The circuitboard 31 is, for example, a main board.

The circuit board 31 includes a first surface 31 a and a second surface31 b opposite to the first surface 31 a. The first surface 31 a is, forexample, the lower surface. The second surface 31 b is, for example, theupper surface. Alternatively, the first surface 31 a may be the uppersurface, and the second surface 31 b may be the lower surface.

As shown in FIG. 6, a CPU 41 (Central Processing Unit), a PCH 42(Platform Controller Hub), a power supply circuit component 43, a memoryslot connector 44, an LCD connector 45, an I/O connector 46, a firstpower coil 47, and a second power coil 48 are provided on the firstsurface 31 a of the circuit board 31.

The CPU 41 is an example of a first heating element and is a componentgenerating the largest amount of heat among the components of thecircuit board 31. The PCH 42 is an example of a heating element and is,for example, a component whose heat may be naturally radiated. The powersupply circuit component 43 is an example of the heating element and isa component generating a relatively large amount of heat among thecomponents of the circuit board 31.

As shown in FIG. 9, a power supply circuit component 49 is provided onthe second surface 31 b of the circuit board 31. The power supplycircuit component 49 is an example of the heating element. The heatingelements on the circuit board 31 are not limited to the above-mentionedcomponents.

As shown in FIG. 4, a direction from the front end portion 14 to therear end portion 13 of the housing 5 is defined as a first direction D1.A direction that is substantially orthogonal to the first direction D1and is from the right wall 8 d to the left wall 8 c is defined as asecond direction D2. A discharge hole 24 c of the cooling fan 24, whichwill be described below, is opened in the first direction D1.

In the specification, the vertical and horizontal directions are definedbased on the normal position (the position shown in FIG. 1) of theelectronic apparatus 1. Therefore, in the description using FIGS. 2, 4to 6, and 8 to 11 in which the electronic apparatus 1 is reversed, theupper, lower, right, and left expressions are contrary to the FIGS.

As shown in FIG. 9, the circuit board 31 is below the keyboard mountingportion 17. As shown in FIG. 4, the circuit board 31 includes a firstportion 31 c between the cooling fan 24 and the heat sink 28 and asecond portion 31 d deviating from the space between the cooling fan 24and the heat sink 28.

The first portion 31 c faces the cooling fan 24 in the direction (firstdirection D1) in which the discharge hole 24 c of the cooling fan 24 isopened. That is, the first portion 31 c is directly exposed to coolingair discharged from the cooling fan 24. In addition, the first portion31 c faces the heat sink 28 in the second direction D2. The secondportion 31 d does not face the cooling fan 24 in the direction in whichthe discharge hole 24 c of the cooling fan 24 is opened.

The CPU 41 and the power supply circuit component 43 are mounted on thefirst portion 31 c of the circuit board 31 and located between the heatsink 28 and the cooling fan 24. The PCH 42 is mounted on the secondportion 31 d of the circuit board 31 and deviates from the space betweenthe heat sink 28 and the cooling fan 24.

The heat sink 28 is an example of the heat radiating portion, and is,for example, a fin unit including a plurality of fins. The heat sink 28is provided in the rear end portion 13 of the housing 5 and faces thefirst outlet 26 of the housing 5. The heat sink 28 is below the keyboardmounting portion 17. In the heat sink 28, the gaps between the fins facethe first outlets 26.

As shown in FIG. 6, the CPU 41 is closer to the cooling fan 24 than thepower supply circuit component 43. The heat pipe 34 is an example of aheat transfer member. The heat pipe 34 extends from the CPU 41 to theheat sink 28. The heat pipe 34 thermally connects the CPU 41 to the heatsink 28 and transfers heat generated from the CPU 41 to the heat sink28.

The heat radiating plate 35 is, for example, a metal plate member. Theheat radiating plate 35 includes a first portion 35 a facing the CPU 41and a second portion 35 b extended away from the CPU 41. The firstportion 35 a is thermally connected to the CPU 41. There is a stepbetween the second portion 35 b and the first portion 35 a and thesecond portion 35 b extends from the first portion 35 a to, for example,the rear side. That is, the second portion 35 b extends in the directionin which air is discharged from the cooling fan 24. There is a gapbetween the second portion 35 b and the power supply circuit component43 and the second portion 35 b covers the lower side of the power supplycircuit component 43. For example, the heat radiating plate 35 is notthermally connected to the power supply circuit component 43.

As shown in FIG. 4, the ODD 32 is accommodated in the right portion ofthe housing 5 opposite to the circuit board 31. An example of thestorage device 33 is an HDD (Hard Disk Drive). The storage device 33 isprovided in the front end portion 14 of the housing 5 so as to beadjacent to the cooling fan 24. The storage device 33 includes a case 51and a magnetic disk (not shown) in the case 51. A side surface 51 a (endsurface) of the case 51 expands in a flat plate shape and faces the sideof the cooling fan 24. The side surface 51 a of the case 51 forms arising wall facing the cooling fan 24 from the side opposite to the leftwall 8 c of the housing 5.

As shown in FIG. 6, the cooling fan 24 is away from the heat sink 28.For example, the cooling fan 24 is provided in the left portion of thefront end portion 14 of the housing 5. As shown in FIG. 9, the coolingfan 24 is below the palm rest 18. That is, the cooling fan 24 deviatesfrom the lower side of the keyboard mounting portion 17 where thethickness of the housing 5 is relatively small, and is below the palmrest 18 where the thickness of the housing 5 is relatively large. Asshown in FIG. 9, there are gaps between the cooling fan 24 and the lowerwall 7 of the housing 5 and between the cooling fan 24 and the upperwall 6 of the housing 5.

The cooling fan 24 is a centrifugal fan and includes a fan case 53 andan impeller 54 rotated in the fan case 53. The fan case 53 includesfirst intakes 24 a, second intakes 24 b, and a discharge hole 24 c.

As shown in FIG. 9, the fan case 53 includes a lower surface 53 a facingthe lower wall 7, an upper surface 53 b opposite to the lower surface 53a and facing the upper wall 6, and a circumferential surface 53 c facingthe circuit board 31. The first intakes 24 a are provided in the lowersurface 53 a of the fan case 53 and face the first inlets 21 of thelower wall 7. The second intakes 24 b are provided in the upper surface53 b of the fan case 53 and are opposite to the first intakes 24 a. Thesecond intakes 24 b face the palm rest 18 with a gap therebetween.

As shown in FIG. 9, as described above, the discharge hole 24 c isopened in the first direction D1 and faces the CPU 41 of the circuitboard 31. The thickness of the discharge hole 24 c is greater than thatof the circuit board 31. The circuit board 31 faces a substantiallyintermediate portion of the discharge hole 24 c in the thicknessdirection of the discharge hole 24 c. The “circuit board facing thesubstantially intermediate portion” means that the circuit board 31 doesnot face the upper and lower ends of the discharge hole 24 c. Thecircuit board 31 does not necessarily face the substantiallyintermediate portion of the discharge hole 24 c in the thicknessdirection.

That is, the discharge hole 24 c may be opened so as to extend from theupper side to the lower side of the circuit board 31. The discharge hole24 c includes a first portion 24 ca close to the first surface 31 a ofthe circuit board 31 and a second portion 24 cb close to the secondsurface 31 b of the circuit board 31.

The cooling fan 24 draws air in the housing 5 through the first intakes24 a and the second intakes 24 b and discharges the air from thedischarge hole 24 c to the CPU 41. In this case, the cooling fan 24discharges air to the upper and lower sides of the circuit board 31.

As shown in FIG. 11, the thickness of the heat sink 28 is larger thanthat of the circuit board 31. The circuit board 31 faces a substantiallyintermediate portion of the heat sink 28 in the thickness direction ofthe heat sink 28. The “circuit board 31 facing the substantiallyintermediate portion” means that the circuit board 31 does not face theupper and lower ends of the heat sink 28. The circuit board 31 does notnecessarily face the substantially intermediate portion of the heat sink28 in the thickness direction.

That is, the heat sink 28 is exposed to the upper and lower sides of thecircuit board 31. The heat sink 28 includes a first portion 28 a closeto the first surface 31 a of the circuit board 31 and a second portion28 b close to the second surface 31 b of the circuit board 31. The firstportion 28 a is exposed to air flowing along the first surface 31 a ofthe circuit board 31. The second portion 28 b is exposed to air flowingalong the second surface 31 b of the circuit board 31.

As shown in FIGS. 6 and 9, the end portion of the circuit board 31facing the discharge hole 24 c of the cooling fan 24 includes acomponent non-mounting region 56. The non-mounting region 56 has a widthof, for example, 5 mm and extends in the width direction of thedischarge hole 24 c along the edge of the circuit board 31. Thenon-mounting region 56 is put on a rail of a mounting apparatus in aprocess of mounting components on the circuit board, such as a reflowprocess. No component is provided on the non-mounting region 56 and thenon-mounting region 56 hardly hinders the flow of air discharged fromthe cooling fan 24.

As shown in FIG. 4, the electronic apparatus 1 includes a wind shieldingportion 64 that partitions the inside of the housing 5 into a firstchamber 61, a second chamber 62, and a third chamber 63. The firstchamber 61 is an air drawing chamber in which the cooling fan 24 drawsfresh air (i.e., outside air). The second chamber 62 is a duct in whichcomponents generating a relatively large amount of heat are mainlymounted and cooling air mainly flows from the cooling fan 24 to the heatsink 28. For example, components with sufficient natural heat radiationcapability are contained in the third chamber 63.

As shown in FIGS. 6 and 8, in this embodiment, the memory slot connector44, the LCD connector 45, the first power coil 47, the second power coil48, and some sealing members 71, 72, 73, 74, 75, 76, and 77 on thecircuit board 31 form the wind shielding portion 64.

Each of the sealing members 71, 72, 73, 74, 75, 76, and 77 is an exampleof an elastic member and is also an example of a non-conductive member.Each of the sealing members 71, 72, 73, 74, 75, 76, and 77 is aninsulating member, such as sponge, rubber, or an insulator. In FIG. 6,some sealing members 73, 74, and 75 are removed. In FIGS. 6 and 8, forconvenience of description, the components forming the wind shieldingportion 64 are hatched.

First, the wind shielding structure of the first chamber 61 will bedescribed.

As shown in FIG. 6, the first sealing member 71 and the second sealingmember 72 are attached to the lower surface 53 a of the cooling fan 24.The first sealing member 71 extends in the width direction (seconddirection D2) of the discharge hole 24 c along the discharge hole 24 cof the cooling fan 24. That is, the first sealing member 71 is providedbetween the first intakes 24 a and the discharge hole 24 c andpartitions the internal space of the housing 5.

The second sealing member 72 extends in the first direction D1 along theright end portion of the cooling fan 24. The second sealing member 72 isopposite to the left wall 8 c of the housing 5 with the first intakes 24a of the cooling fan 24 interposed therebetween. That is, the firstintakes 24 a of the cooling fan 24 are located between the secondsealing member 72 and the left wall 8 c of the housing 5.

As shown in FIGS. 9 and 10, the first sealing member 71 and the secondsealing member 72 are provided between the lower surface 53 a of thecooling fan 24 and the inner surface of the lower wall 7 of the housing5. The first sealing member 71 and the second sealing member 72 arecompressed in the gap between the lower surface 53 a of the cooling fan24 and the inner surface of the lower wall 7 of the housing 5, therebyairtightly sealing the gap.

In this way, as schematically shown in FIG. 13, the first chamber 61surrounded by the first sealing member 71, the second sealing member 72,the left wall 8 c of the housing 5, and the front wall 8 a of thehousing 5 is formed in the corner of the housing 5.

In this embodiment, the first sealing member 71 and the second sealingmember 72 are provided on the surface of the cooling fan 24 and are notprovided in a region deviating from the cooling fan 24. That is, thefirst sealing member 71 and the second sealing member 72 do notcompletely partition the first chamber 61 in the housing 5, butpartially partition the first chamber 61 in the housing 5.

The first sealing member 71 and the second sealing member 72 may extendto the region deviating from the cooling fan 24 and completely partitionthe first chamber 61 in the housing 5. In this embodiment, the sidesurface 51 a of the case 51 of the storage device 33 supplementarilyserves a part of the wall (i.e., side surface) of the first chamber 61.

As shown in FIGS. 9 and 10, another first sealing member 71 and anothersecond sealing member 72 are on the upper surface 53 b of the coolingfan 24, similarly to the lower surface 53 a. That is, the first sealingmember 71 extends in the width direction of the discharge hole 24 calong the discharge hole 24 c of the cooling fan 24. The first sealingmember 71 is provided between the second intakes 24 b and the dischargehole 24 c and partitions the inner space of the housing 5. The secondsealing member 72 extends in the first direction D1 along the right endportion of the cooling fan 24.

The first sealing member 71 and the second sealing member 72 areprovided between the upper surface 53 b of the cooling fan 24 and theinner surface (the inner surface of the palm rest 18) of the upper wall6 of the housing 5. The first sealing member 71 and the second sealingmember 72 are compressed in the gap between the upper surface 53 b ofthe cooling fan 24 and the inner surface of the upper wall 6 of thehousing 5, thereby airtightly sealing the gap.

As shown in FIGS. 6 and 9, the first inlets 21, the second inlets 22,and the third inlets 23 of the housing 5, and the first intakes 24 a andthe second intakes 24 b of the cooling fan 24 are exposed to the firstchamber 61. There is no heating element on the circuit board 31 in thefirst chamber 61. The first chamber 61 communicates with the housing 5through the first inlets 21, the second inlets 22, and the third inlets23 such that fresh air can flow into the first chamber 61. Therefore,the temperature of air in the first chamber 61 is lower than that in theother chambers.

Next, the wind shielding structure of the second chamber 62 (ductportion) will be described.

As shown in FIG. 6, the memory slot connector 44 to which a memory 81 isattached is mounted on the circuit board 31. The memory slot connector44 is an example of a board component, an example of a long connector,and an example of a “component in the housing”. The term “longconnector” means that a length of a connector in its longitudinaldirection is longer than one side of the chip of the CPU 41 (firstheating element). The “long connector” is not limited to the memory slotconnector 44, but may be, for example, a docking connector or aconnector for a television tuner.

As shown in FIG. 6, the longitudinal direction of the memory slotconnector 44 is aligned with the discharge direction (first directionD1) of the cooling fan 24. The memory 81 includes a memory board 81 b onwhich a plurality of memory chips 81 a is mounted. The memory slotconnector 44 is adjacent to the CPU 41, with the memory 81 facing theopposite side of the CPU 41.

The memory slot connector 44 includes a pair of holders 83 that holdsthe memory 81 spaced apart from the circuit board 31 and a terminalportion 84 attached to the circuit board 31. The terminal portion 84includes a slot to which the memory 81 is electrically connected and aplurality of wires for connecting the memory 81 to the CPU 41. Theterminal portion 84 closely adheres to the circuit board 31 and there isno gap between the terminal portion 84 and the circuit board 31.

As shown in FIG. 11, the memory slot connector 44 is a second stageconnector of a so-called two-stage memory connecting portion. That is,another memory slot connector 44 a is mounted between the memory 81attached to the memory slot connector 44 and the circuit board 31. Inother words, the terminal portion 84 of the memory slot connector 44 isrelatively high.

As shown in FIG. 6, the memory slot connector 44 is arranged such thatthe terminal portion 84 is closer to the CPU 41 than the holders 83. Aportion of the memory slot connector 44 faces the CPU 41. The memoryslot connector 44 is arranged in substantially parallel to the CPU 41.As shown in FIG. 7, the terminal portion 84 is electrically connected tothe CPU 41 by a plurality of wiring patterns 85.

As shown in FIG. 6, the memory slot connector 44 extends from the sideof the CPU 41 to the side of the power supply circuit component 43. Thememory slot connector 44 faces a part of the heat sink 28, the secondpower coil 48, and the I/O connector 46 in the second direction D2.

As shown in FIG. 6, the first power coil 47 and the LCD connector 45 areprovided between the end portion of the memory slot connector 44 and theend portion of the heat sink 28. Each of the first power coil 47 and theLCD connector 45 is an example of the board component. The first powercoil 47 and the LCD connector 45 are arranged in the second directionD2.

The first power coil 47 and the LCD connector 45 face the discharge hole24 c of the cooling fan 24 in the first direction D1. That is, airdischarged from the discharge hole 24 c of the cooling fan 24 passesthrough the CPU 41 and the power supply circuit component 43, collideswith the first power coil 47 and the LCD connector 45, and flows to theheat sink 28.

The second power coil 48 is opposite to the memory slot connector 44with the CPU 41 interposed therebetween. The gap between the secondpower coil 48 and the memory slot connector 44 is substantially equal tothe width of the discharge hole 24 c of the cooling fan 24.

The memory slot connector 44, the first power coil 47, the LCD connector45, and the second power coil 48 arranged in this way form a wind guidepath 91 with a duct structure through which cooling air flows from thecooling fan 24 to the heat sink 28, in cooperation with the lower wall 7and the left wall 8 c of the housing 5. That is, each of the memory slotconnector 44, the first power coil 47, the LCD connector 45, and thesecond power coil 48 forms at least a part of the wall surface of thewind guide path 91. In other words, each of the memory slot connector44, the first power coil 47, the LCD connector 45, and the second powercoil 48 is configured to serve as a wall that guides cooling air fromthe cooling fan 24 to the heat sink 28.

Specifically, the wind guide path 91 according to this embodimentincludes a first flow path 91 a and a second flow path 91 b. The firstflow path 91 a is formed in a substantially L shape on the first surface31 a of the circuit board 31 (that is, between the circuit board 31 andthe lower wall 7 of the housing 5). The second flow path 91 b is formedon the second surface 31 b of the circuit board 31 (that is, between thecircuit board 31 and the upper wall 6 of the housing 5) in the sameshape as that of the first flow path 91 a, that is, in a substantially Lshape.

The memory slot connector 44, the first power coil 47, the LCD connector45, and the second power coil 48 form the first flow path 91 a. As shownin FIG. 6, the CPU 41, the power supply circuit component 43, the heatpipe 34, and the heat radiating plate 35 are located in the wind guidepath 91. That is, the CPU 41, the power supply circuit component 43, theheat pipe 34, and the heat radiating plate 35 are provided between thecooling fan 24 and the heat sink 28.

As shown in FIGS. 8 and 10, the third sealing member 73 is providedbetween the terminal portion 84 of the memory slot connector 44 and theinner surface of the lower wall 7 of the housing 5. The third sealingmember 73 is an example of the first sealing portion. The third sealingmember 73 extends in the first direction D1. The third sealing member 73has a length substantially equal to that of the terminal portion 84 ofthe memory slot connector 44.

The third sealing member 73 is compressed in the gap between the memoryslot connector 44 and the lower wall 7 of the housing 5, therebyairtightly sealing the gap. The third sealing member 73 forms a part ofthe wall surface of the first flow path 91 a of the wind guide path 91.

As shown in FIGS. 8 and 10, the housing 5 includes a boss 95 and a rib96, which are protrusions protruding from the inner surface of the lowerwall 7 of the housing 5 toward the circuit board 31. The boss 95 and therib 96 are positioned between the cooling fan 24 and the memory slotconnector 44 and form a part of the wall surface of the wind guide path91.

As shown in FIG. 8, the fourth sealing member 74 is provided between thefirst power coil 47 and the inner surface of the lower wall 7 of thehousing 5. For example, the fourth sealing member 74 extends from theend portion of the memory slot connector 44 to the end portion of theLCD connector 45. The fourth sealing member 74 is compressed in the gapbetween the first power coil 47 and the lower wall 7 of the housing 5,thereby airtightly sealing the gap. The fourth sealing member 74 mayextend to, for example, the end portion of the heat sink 28. Inaddition, the fourth sealing member 74 may be provided between the LCDconnector 45 and the inner surface of the lower wall 7 of the housing 5.

As shown in FIG. 8, the fifth sealing member 75 is provided between thesecond power coil 48 and the inner surface of the lower wall 7 of thehousing 5. For example, the fifth sealing member 75 extends from the endportion of the cooling fan 24 to the end portion of the heat sink 28.The fifth sealing member 75 is compressed in the gap between the secondpower coil 48 and the lower wall 7 of the housing 5, thereby airtightlysealing the gap. For example, the fifth sealing member 75 may be only ina portion of the space between the cooling fan 24 and the heat sink 28.Each of the fourth sealing member 74 and the fifth sealing member 75forms a part of the wall surface of the first flow path 91 a of the windguide path 91.

As shown in FIGS. 8 and 11, the sixth sealing member 76 is providedbetween the heat sink 28 and the inner surface of the lower wall 7 ofthe housing 5. The sixth sealing member 76 extends over the entirelength of the heat sink 28 in the longitudinal direction (firstdirection D1). The sixth sealing member 76 is compressed in the gapbetween the heat sink 28 and the lower wall 7 of the housing 5, therebyairtightly sealing the gap. In this way, cooling air reaching the heatsink 28 is exhausted to the outside through the gaps between the fins ofthe heat sink 28 without passing through the gap between the heat sink28 and the inner surface of the housing 5.

As shown in FIG. 11, similarly, the sixth sealing member 76 is providedbetween the heat sink 28 and the inner surface of the upper wall 6 ofthe housing 5. The sixth sealing member 76 is compressed in the gapbetween the heat sink 28 and the upper wall 6 of the housing 5, therebyairtightly sealing the gap.

As shown in FIG. 11, the keyboard mounting portion 17 according to thisembodiment includes a relatively large opening portion through which thekeyboard 9 is exposed to the housing 5. The sixth sealing member 76 alsoextends between the heat sink 28 and the lower surface of the keyboard9. The sixth sealing member 76 is compressed in the gap between the heatsink 28 and the lower surface of the keyboard 9, thereby airtightlysealing the gap.

As shown in FIG. 10, the seventh sealing member 77 is provided betweenthe second surface 31 b of the circuit board 31 and the inner surface ofthe upper wall 6 of the housing 5. The seventh sealing member 77 is anexample of a second sealing portion. The seventh sealing member 77 iscompressed in the gap between the circuit board 31 and the inner surfaceof the upper wall 6 of the housing 5, thereby airtightly sealing thegap. When a board component is mounted on the second surface 31 b of thecircuit board 31, a sealing member between the board component and theinner surface of the housing is also included in “the sealing memberbetween the second surface of the circuit board and the inner surface ofthe housing”.

As shown in FIG. 10, the seventh sealing member 77 also extends betweenthe second surface 31 b of the circuit board 31 and the lower surface ofthe keyboard 9. The seventh sealing member 77 is compressed in the gapbetween the second surface 31 b of the circuit board 31 and the lowersurface of the keyboard 9, thereby airtightly sealing the gap.

For example, the seventh sealing member 77 has substantially the sameshape as an integrated body of the third sealing member 73 and thefourth sealing member 74. However, the shape of the seventh sealingmember 77 is not limited thereto.

The seventh sealing member 77, the upper wall 6 (or the keyboard 9) ofthe housing 5 and the left wall 8 c of the housing 5 form the secondflow path 91 b of the wind guide path 91 through which cooling air flowsfrom the cooling fan 24 to the heat sink 28. That is, the seventhsealing member 77 forms a part of the wall (i.e., side surface) of thewind guide path 91. As shown in FIG. 9, the power supply circuitcomponent 49 is located in the second flow path 91 b.

Air discharged from the first portion 24 ca of the discharge hole 24 cof the cooling fan 24 flows through the first flow path 91 a and reachesthe first portion 28 a of the heat sink 28. Air discharged from thesecond portion 24 cb of the discharge hole 24 c of the cooling fan 24flows through the second flow path 91 b and reaches the second portion28 b of the heat sink 28. The gap between the second surface 31 b of thecircuit board 31 and the upper wall 6 of the housing 5 is smaller thanthe gap between the first surface 31 a and the lower wall 7 of thehousing 5.

As shown in FIG. 8, the second chamber 62 surrounded by the memory slotconnector 44, the third sealing member 73, the first power coil 47, thefourth sealing member 74, the LCD connector 45, the boss 95, the rib 96,the seventh sealing member 77, and the left wall 8 c of the housing 5 isformed in the left end portion of the housing 5. Each of the componentsaccording to this embodiment does not completely partition the secondchamber 62 in the housing 5, but partially partitions the second chamber62 in the housing 5. The second chamber 62 may be completely partitionedin the housing 5.

The first outlets 26, the second outlets 27, the CPU 41, the powersupply circuit component 43, the power supply circuit component 49, theheat sink 28, the heat pipe 34, the heat radiating plate 35, and thedischarge hole 24 c of the cooling fan 24 of the housing 5 are exposedto the second chamber 62.

As shown in FIG. 4, the housing 5 includes the third chamber 63 at leastpartially partitioned from the first chamber 61 and the second chamber62. The third chamber 63 is partitioned from the first chamber 61 andthe second chamber 62 by the second sealing member 72, the boss 95, therib 96, the memory slot connector 44, the third sealing member 73, thefirst power coil 47, the fourth sealing member 74, the LCD connector 45,and the seventh sealing member 77.

As shown in FIG. 2, the third chamber 63 communicates with the outsidethrough vent holes 98 in the lower wall 7 of the housing 5. As shown inFIG. 4, the PCH 42, the memory 81, the ODD 32, and the storage device 33are exposed to the third chamber 63. A heat radiating member is notattached to the PCH 42 or the memory 81, and heat generated from the PCH42 and the memory 81 is naturally radiated.

The first portion 31 c of the circuit board 31 is exposed to the secondchamber 62. The second portion 31 d of the circuit board 31 is exposedto the third chamber 63. Each of the components according to thisembodiment does not completely partition the third chamber 63 in thehousing 5, but partially partitions the third chamber 63. The thirdchamber 63 may be completely partitioned in the housing 5.

Next, the operation of the electronic apparatus 1 will be described withreference to FIGS. 12 to 14 schematically showing the structure of thisembodiment.

As shown in FIGS. 12 and 13, the inside of the housing 5 is divided intothe first chamber 61 and the second chamber 62. A structure (the firstsealing member 71 and the second sealing member 72) that shields theflow of air is provided between the first chamber 61 and the secondchamber 62. The first intakes 24 a and the second intakes 24 b of thecooling fan 24 are exposed to the first chamber 61. The discharge hole24 c of the cooling fan 24 is exposed to the second chamber 62. That is,a partial sealing region that closes up the air intakes 24 a and 24 b ofthe cooling fan 24 is formed in the corner of the housing 5.

The cooling fan 24 draws air from the outside of the housing 5 to thefirst chamber 61 and discharges the air from the first chamber 61 to thesecond chamber 62. The air intakes 24 a, 24 b of the cooling fan 24 arenot exposed to the second chamber 62 and the third chamber 63.Therefore, the cooling fan 24 draws a small amount of air or hardlydraws air in the second chamber 62 and the third chamber 63 heated bythe CPU 41 or the PCH 42, the power supply circuit component 43, and theother heating elements.

The cooling fan 24 draws low-temperature air from the outside of thehousing 5 through the first chamber 61 and discharges thelow-temperature air to, for example, the CPU 41 in the second chamber62. In this embodiment, the air inlets are in the lower wall 7 and thecircumferential wall 8 of the housing 5. However, the air inlets may bein at least one of the upper wall 6, the lower wall 7, and thecircumferential wall 8 of the housing 5.

As shown in FIG. 14, the wind guide path 91 guiding cooling air from thecooling fan 24 to the heat sink 28 is formed in the housing 5 by theboard components on the circuit board 31. Specifically, the memory slotconnector 44, the first power coil 47, the LCD connector 45, and thesecond power coil 48 form both wall surfaces of the wind guide path 91.

That is, a space surrounded by the memory slot connector 44, the firstpower coil 47, the LCD connector 45, the second power coil 48, thecircuit board 31, and the lower wall 7 and the upper wall 6 (or thekeyboard 9) of the housing 5 is the wind guide path 91. In thisembodiment, the airtightness of the wind guide path 91 is improved bythe third to seventh sealing members 73, 74, 75, 76, and 77.

Therefore, as represented by an arrow in FIG. 14, cooling air dischargedfrom the cooling fan 24 flows to the heat sink 28 on the circuit board31. That is, cooling air discharged from the cooling fan 24 is reliablyfocused on, for example, the CPU 41 or the heat sink 28 without beingwidely spread in the housing 5, thereby effectively cooling the CPU 41or the heat sink 28.

According to this structure, it is possible to mount components at highdensity.

For example, it is also considered that a wind guide plate or a dummycomponent is mounted on the circuit board in order to provide a ductstructure in the housing 5. In addition, it is considered that a rib isprovided close to the surface of the circuit board in the housing.However, in these structures, it is impossible to mount indispensablecomponents in a board region in which the wind guide plate or the dummycomponent is mounted or a board region close to the rib, which makes itdifficult to mount components at high density.

According to the structure of this embodiment, a part of the wind guidepath 91 is formed by the housing 5, the circuit board 31, and the boardcomponents 44, 45, 46, 47, and 48 mounted on the circuit board 31.Therefore, it is possible to remove the wind guide plate, the dummycomponent, or the rib of the housing or reduce the number of them andthus effectively use the mounting area of the circuit board 31. As aresult, it is possible to mount components at high density. It is alsopossible to simplify the structure of the housing or reducemanufacturing costs.

In this embodiment, a part of the wind guide path 91 is formed by theboard components. However, the wind guide path 91 may be formed bycomponents (for example, various kinds of modules and units, such as astorage device) other than the board components and a wind shieldingportion between the components and the inner surface of the housing 5.In this case, the mounting restrictions of the circuit board 31 arereduced and it is possible to mount components at high density.

When the wind shielding portion 64 is provided between the boardcomponents 44, 47, and 48 and the inner surface of the housing 5, theairtightness of the wind guide path 91 is improved and it is possible toeffectively discharge cooling air to the CPU 41, the power supplycircuit component 43, and the heat sink 28. In this way, it is possibleto improve heat radiation efficiency.

The long connector has a relatively large length along the circuit board31 and a relatively large height for connection to the memory 81 orother modules, among the components on the circuit board 31. When thelong and tall component is used to form the wind guide path 91, it ispossible to improve the airtightness and stability of the wind guidepath 91.

When the longitudinal direction of the long connector is aligned withthe discharge direction of the cooling fan 24, cooling air dischargedfrom the cooling fan 24 can flow along the long connector. Therefore,pressure loss is reduced, and cooling air can effectively flow to theheat sink 28.

The memory 81 is one of the heating elements. Therefore, it isconsidered that the memory slot connector 44 is mounted such that thememory 81 faces the wind guide path 91. That is, it is considered thatthe memory 81 is exposed to the wind guide path 91 to accelerate thecooling of the memory 81.

However, in this embodiment, the memory slot connector 44 is mountedsuch that the memory 81 is opposite to the wind guide path 91. Accordingto this structure, (1) it is possible to arrange the tall terminalportion 84 of the memory slot connector 44 close to the CPU 41 and formthe wall surface of the wind guide path 91 close to the CPU 41. In thisway, it is possible to effectively guide cooling air to the CPU 41 andimprove the overall heat radiation efficiency of the apparatus.

In this structure, (2) it is possible to arrange the terminal portion 84close to the CPU 41. Therefore, it is possible to reduce the length ofthe wiring pattern 85 connecting the terminal portion 84 and the CPU 41and simplify the layout of the wiring pattern 85. In this way, it ispossible to increase the mounting area of the circuit board 31 and mountcomponents at high density.

In this embodiment, the memory slot connector 44 includes the holders 83that hold the memory 81 so as to be spaced apart from the circuit board31 and the terminal portion 84 closely adhering to the circuit board 31,and the terminal portion 84 is closer to the CPU 41 than the holders 83.According to this structure, the terminal portion 84 that closelyadheres to the circuit board 31 such that cooling air does not leak iscloser to the CPU 41 than the holder 83 that is separated from thecircuit board 31 with a gap therebetween through which cooling airleaks. Therefore, the flow of the cooling air is stabilized.

The memory slot connector 44 is arranged in parallel to the CPU 41 andthe flow of cooling air to the CPU 41 is stabilized. In addition, it ispossible to simplify and shorten the wiring pattern 85 between thememory slot connector 44 and the CPU 41.

When the heat pipe 34 thermally connecting the CPU 41 to the heat sink28 is provided in the wind guide path 91, the heat pipe 34 is directlyexposed to cooling air and the cooling of the heat pipe 34 isaccelerated. In this way, it is possible to further improve heatradiation efficiency.

When the circuit board 31 faces a substantially intermediate portion ofthe discharge hole 24 c of the cooling fan 24 in the thickness directionof the discharge hole 24 c, cooling air flows from the cooling fan 24 tothe upper and lower sides of the circuit board 31. That is, it ispossible to form the wind guide path 91 so as to extend between theupper and lower sides of the circuit board 31 and thus cool componentson both surfaces of the circuit board 31.

When the wind shielding portion 64 includes the first sealing portionbetween the board component on the first surface 31 a of the circuitboard 31 and the inner surface of the housing 5 and the second sealingportion between the second surface 31 b and the inner surface of thehousing 5, it is possible to form the wind guide paths 91 withrelatively high airtightness on both surfaces of the circuit board 31.Therefore, it is possible to further improve heat radiation efficiency.

The cooling fan 24 is a component with a relatively large height(thickness) among the components in the housing 5. When the cooling fan24 is below the palm rest 18, it is possible to accommodate the coolingfan 24 below the palm rest 18 in which the thickness of the housing 5 islarger than that below the keyboard mounting portion 17. Therefore, itis possible to reduce the thickness of the housing 5.

When many components are at the end portion of the circuit board 31facing the discharge hole 24 c of the cooling fan 24, cooling airdischarged from the discharge hole 24 c is likely to be scattered by thecomponents. However, in this embodiment, the non-mounting region 56extending in the width direction of the discharge hole 24 c is at theend portion of the circuit board 31 facing the discharge hole 24 c.Therefore, cooling air discharged from the discharge hole 24 c is hardlyscattered and effectively flows to the CPU 41 and the heat sink 28. As aresult, it is possible to further improve heat radiation efficiency.

Second Embodiment

Next, an electronic apparatus 1 according to a second embodiment will bedescribed with reference to FIG. 15. In the second embodiment,components having the same or similar functions as those of the firstembodiment are denoted by the same reference numerals and a descriptionthereof will not be repeated. In addition, structures other than thefollowing structures are the same as those in the first embodiment.

As shown in FIG. 15, in this embodiment, an I/O connector 46 forms apart of the wall (i.e., side surface) of a wind guide path 91. The I/Oconnector 46 includes a shell 101 made of metal and a terminal portion(not shown) in the shell 101. A housing 5 is made of metal, for example.The housing 5 may be made of a resin and may have a conductor layer onthe inner surface thereof. The conductor layer is formed by, forexample, plating, a conductive coating layer, or the attachment of ametal foil.

A conductive member 102 is provided between the I/O connector 46 and thehousing 5. The conductive member 102 is, for example, a gasket. However,the conductive member 102 may be a leaf spring instead of the gasket.The conductive member 102 is provided between the I/O connector 46 andthe housing 5 and electrically connects the I/O connector 46 to thehousing 5. The conductive member 102 functions as a member for ESD(Electro-Static Discharge) or EMI (Electro Magnetic Interference).

In this embodiment, the conductive member 102 forms a part of the wall(i.e., side surface) of the wind guide path 91. That is, the conductivemember 102 is configured to serve as a wall that guides cooling air froma cooling fan 24 to a heat sink 28. The connector on which theconductive member 102 is provided is not limited to the I/O connector46, but may be other kinds of connectors.

As shown in FIG. 15, a heating component 103 is mounted on a secondsurface 31 b of a circuit board 31. The heating component 103 is anexample of the second heating element and is, for example, a power coil,a capacitor, or an IC. The heating component 103 is not limited thereto,and only needs to be a component with a temperature higher than theaverage temperature of the circuit board 31. In this embodiment, theheating component 103 forms a part of the wall (i.e., side surface) ofthe wind guide path 91. That is, the heating component 103 is configuredto serve as a wall that guides cooling air from the cooling fan 24 tothe heat sink 28.

The housing 5 includes a rib 104 whose protrusion is adjusted accordingto the height of a component (in this embodiment, the heating component103) forming a part of the wall (i.e., side surface) of the wind guidepath 91. The rib 104 is an example of the wind shielding portion. Therib 104 protrudes from the inner surface of the housing 5 toward thecomponent forming a part of the wall (i.e., side surface) of the windguide path 91 such that a gap of, for example, several millimetersexists between the rib 104 and the component. The rib 104 forms a partof the wall (i.e., side surface) of the wind guide path 91.

According to this structure, similarly to the first embodiment, it ispossible to mount components at high density. In this embodiment, theconnector 46 is on the circuit board 31 and the conductive member 102 isprovided between the connector 46 and the inner surface of the housing5, forms a part of the side surface of the wind guide path 91, andelectrically connects the connector 46 to the inner surface of thehousing 5. According to this structure, a part of the wall (i.e., sidesurface) of the wind guide path 91 can be formed by a conductive memberfor ESD or EMI. In this way, for example, it is possible to reduce thenumber of components. As a result, it is possible to reducemanufacturing costs and improve assemblability.

When the heating component 103 is provided on the circuit board 31 and apart of the wall (i.e., side surface) of the wind guide path 91 isformed by the heating component 103, the heating component 103 isexposed to cooling air passing through the wind guide path 91.Therefore, the cooling of the heating component 103 is accelerated. Inthis way, it is possible to improve heat radiation efficiency.

When a part of the wall (i.e., side surface) of the wind guide path 91is formed by the rib 104 protruding from the housing 5 toward the boardcomponent, it is possible to reduce the number of additional members inthe housing 5.

Third Embodiment

Next, a display device 111 according to a third embodiment will bedescribed with reference to FIG. 16. In the third embodiment, componentshaving the same or similar functions as those of the first embodimentare denoted by the same reference numerals and a description thereofwill not be repeated. In addition, structures other than the followingstructures are the same as those in the first embodiment.

As shown in FIG. 16, the display device 111 includes a housing 5 and adisplay panel 16 in the housing 5. An example of the display device 111is a television. The same structure as that in the first embodiment orthe second embodiment is in the housing 5.

According to the display device 111 having the above-mentionedstructure, similarly to the first embodiment or the second embodiment,it is possible to mount components at high density.

The electronic apparatuses 1 and the display device 111 according to thefirst to third embodiments have been described above, but theembodiments are not limited thereto. The embodiments are not limited tothe above-described embodiments, but the components may be changedwithout departing from the scope and spirit of the invention.

For example, the inside of the housing 5 is not necessarily partitionedby a first chamber 61, a second chamber 62, and a third chamber 63, butit is only necessary that a wind guide path 91 be formed from a coolingfan 24 to a heat sink 28. That is, sealing members 71 and 72 may beomitted. The members partitioning the first chamber 61, the secondchamber 62, and the third chamber 63 may not be the sealing members, butmay be a portion of the housing 5 (for example, a rib).

For example, various kinds of connectors or power coils are given as anexample of the board components forming a part of the wall of the windguide path 91, but other components may be used as the board components.The memory slot connector may be mounted such that the memory faces theCPU. The wind guide path may be provided on one surface of the circuitboard. The wind guide path 91 may be formed only by the boardcomponents, in which case the sealing members 73, 74, 75, 76, and 77 maybe appropriately omitted.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. An electronic apparatus comprising: a housingcomprising an outlet; a heat sink inside the housing and facing theoutlet; a cooling fan inside the housing; a circuit board comprising afirst heating element located between the heat sink and the cooling fan,and a memory slot connector configured to receive a memory at a sideopposite to the first heating element and the memory slot connectorconfigured to guide air from the cooling fan to the heat sink; and awind shield between the memory slot connector and an inner surface ofthe housing.
 2. The electronic apparatus of claim 1, wherein the memoryslot connector is a long connector.
 3. The electronic apparatus of claim1, wherein a longitudinal direction of the memory slot connector isaligned parallel with a direction of an air flow from the cooling fan.4. The electronic apparatus of claim 1, wherein the memory slotconnector comprises: a holder configured to hold the memory spaced apartfrom the circuit board; and a terminal portion attached to the circuitboard, the terminal portion being proximal to the first heating elementcompared to the holder.
 5. The electronic apparatus of claim 1, whereinthe memory slot connector is parallel to the first heating element andelectrically connected to the first heating element by a plurality ofwiring patterns.
 6. The electronic apparatus of claim 1, furthercomprising: a heat pipe thermally connecting the first heating elementto the heat sink and located between the cooling fan and the heat sink.7. The electronic apparatus of claim 1, wherein the cooling fancomprises a discharge hole with a first thickness that is wider than asecond thickness of the circuit board, and an end portion of the circuitboard is positioned at a substantially intermediate portion with respectto the first thickness of the discharge hole.
 8. The electronicapparatus of claim 1, wherein the circuit board comprises a firstsurface on which the memory slot connector is mounted and a secondsurface opposite to the first surface, and the wind shield comprises afirst sealing portion between the memory slot connector and the innersurface of the housing and a second sealing portion between the secondsurface and another inner surface of the housing.
 9. The electronicapparatus of claim 1, wherein the housing comprises a palm rest with arecess, and a keyboard mounting portion located in the recess, thecooling fan is below the palm rest, and the circuit board is below thekeyboard mounting portion.
 10. The electronic apparatus of claim 1,further comprising: a connector on the circuit board; and a conductivemember between the connector and the inner surface of the housing,configured to guide the air from the cooling fan to the heat sink,wherein the conductive member is electrically connecting the connectorto the inner surface of the housing.
 11. The electronic apparatus ofclaim 1, further comprising: a second heating element on the circuitboard, wherein the second heating element is configured to guide the airfrom the cooling fan to the heat sink.
 12. The electronic apparatus ofclaim 1, wherein the cooling fan comprises a discharge hole, and thecircuit board comprises an end portion facing the discharge hole of thecooling fan, the end portion comprising a component non-mounting regionextending in a width direction of the discharge hole, the widthdirection being substantially parallel to the end portion of the circuitboard.
 13. The electronic apparatus of claim 1, wherein the memory slotconnector is located adjacent to the first heating element.